JHFRTP® TPI fiber-reinforced thermoplastic polyetherimide composites
Product Overview
JHFRTP® TPI series is a high-end, high-performance thermoplastic composite material. It uses T300-grade 3K satin carbon fiber fabric as reinforcement and amorphous thermoplastic polymer TPI as prepreg resin, and is formed by high-temperature hot pressing.
It possesses excellent properties such as light weight, high strength, high toughness, high damage resistance, fatigue resistance, resistance to damp heat, and corrosion resistance, and can be used at temperatures up to 300°C for extended periods. It is widely used in aerospace, petrochemical, and medical fields.
Technical Data Sheet
| project | Test Standards | unit | Typical index values |
|---|
| Resin properties |
| density | ISO 1183 | g/cm³ | 1.3 |
| Glass transition temperature (Tg) | ISO 11357.2 | °C | 250 |
| Molding processing temperature (Tp) | – | °C | 360-410 |
| Physical properties |
| Fiber surface density | HB7736.3-2004 | g/m² | 285 |
| Prepreg surface density | HB7736.2-2004 | g/m² | 485 |
| Resin content | HB7736.5-2004 | % | 42±3 |
| Single-layer curing thickness | According to the thickness of the plate | mm | 0.3±0.02 |
| Density (Laminated Board) | ASTM D792 | g/cm³ | 1.55 |
| Mechanical properties |
| Tensile strength | ASTM D3039 | MPa | 650 |
| Tensile modulus | ASTM D3039 | GPa | 54 |
| Bending strength | ASTM D7264 | MPa | 806 |
| Flexural modulus | ASTM D7264 | GPa | 48 |
| Compressive strength | ASTM D6641 | MPa | 427 |
| compression modulus | ASTM D6641 | GPa | 56 |
| Interlaminar shear strength | ASTM D2344 | MPa | 67 |
Comparison of thermosetting PI and TPI
| Advantages and characteristics | thermosetting PI | thermoplastic PI |
|---|
| Basic characteristics | It possesses excellent electrical insulation, mechanical properties, chemical stability, aging resistance, and radiation resistance. It exhibits low dielectric loss, and these properties do not change significantly over a wide temperature range (-269°C to 400°C). | It retains the high strength, high and low temperature resistance, good dielectric properties, and radiation resistance of thermosetting polyimide (PI), while also improving processability. Continuous operating temperature exceeds 240°C. |
| Molding method | It does not melt or flow, or even soften, when heated to its decomposition temperature, making it difficult to mold and process, resulting in limited product forms and making it impossible to recycle or reshape. | It has good melting properties and can be formed by hot molding, extrusion or injection molding. It is suitable for products with complex structures that can be formed in one step without secondary processing. |
| Structural features | Three-dimensional polymers are formed through chemical cross-linking to create a rigid three-dimensional network structure that cannot be repeatedly processed and molded. | Linear polymers that can be repeatedly processed. |
PI (Polyimide) Performance Sheet
| Testing items | Test Standards | unit | JHPI-10 | JHPI-10-21 | JHPI-10-22 | JHPI-HT | JHPI-YS | JSJHTPI-01 | JSJHTPI-02 |
|---|
| density | ISO 1183 | g/cm³ | 1.40 | 1.43 | 1.7 | 1.4 | 1.36 | 1.32 | 1.36 |
| Tensile strength | ISO 527 | MPa | 96 | 90 | 60 | 92 | 121 | 90 | 97 |
| Elongation at break | ISO 527 | % | 10 | 5 | 2.5 | 8 | 13 | 8 | 8 |
| Bending strength | ISO 178 | MPa | 148 | 126 | 90 | 140 | 171 | 130 | 138 |
| Impact strength of simply supported beam | ISO 179 | kJ/m² | 90 | 135 | 13 | 88 | (No Break) | 100 | (No Break) |
| Heat distortion temperature | ISO 75-1/-2 | °C | >300 | >300 | >300 | >320 | 255 | 230 | 250 |
| Continuous operating temperature | UL746B | °C | 350 | 350 | 350 | 380 | 250 | 250 | 250 |
