JHFRTP TPI


JHFRTP ® TPI fiber reinforced thermoplastic polyetherimide composite material Product Overview JHFRTP ® TPI series is a type of high-end, high-performance thermoplastic composite material, using T300 grade-3K satin carbon fiber fabric as reinforcement material and amorphous thermoplastic polymer TPI as pre-impregnated resin compound, and is formed by high-temperature hot pressing. It has excellent properties such […]


Product Details

JHFRTP ® TPI fiber reinforced thermoplastic polyetherimide composite material

Product Overview

JHFRTP ® TPI series is a type of high-end, high-performance thermoplastic composite material, using T300 grade-3K satin carbon fiber fabric as reinforcement material and amorphous thermoplastic polymer TPI as pre-impregnated resin compound, and is formed by high-temperature hot pressing.

It has excellent properties such as light weight, high strength, high toughness, high damage resistance, fatigue resistance, heat and humidity resistance, and corrosion resistance, and can be used at a temperature of up to 300°C for a long time. It is widely used in aerospace, petroleum and petrochemical, medical and other fields.

Technical Data Sheet

project Test standards unit Typical index values
Resin properties
density ISO 1183 g/cm³ 1.3
Glass transition temperature (Tg) ISO 11357.2 °C 250
Molding temperature (Tp) °C 360-410
Physical properties
Fiber surface density HB7736.3-2004 g/m² 285
Prepreg surface density HB7736.2-2004 g/m² 485
Resin content HB7736.5-2004 % 42±3
Single layer cured thickness According to the thickness of the plate mm 0.3±0.02
Density (laminate) ASTM D792 g/cm³ 1.55
Mechanical properties
tensile strength ASTM D3039 MPa 650
Tensile modulus ASTM D3039 GPa 54
Bending strength ASTM D7264 MPa 806
flexural modulus ASTM D7264 GPa 48
Compression strength ASTM D6641 MPa 427
Compression modulus ASTM D6641 GPa 56
Interlaminar shear strength ASTM D2344 MPa 67

Comparison between thermosetting PI and TPI

Advantages and characteristics Thermosetting PI Thermoplastic PI
Basic Features It has good electrical insulation, mechanical properties, chemical stability, aging resistance, radiation resistance, low dielectric loss, and these properties do not change significantly over a wide temperature range (-269°C-400°C). It retains the high strength, high and low temperature resistance, good dielectric properties, and radiation resistance of thermosetting PI, while improving processability. The continuous operating temperature exceeds 240°C.
Molding method It will not melt or flow when heated to decomposition temperature, and will not even soften. It is difficult to form and process, the product form is single, and it cannot be recycled or reshaped. It has good melting properties and can be formed by hot compression molding, extrusion or injection molding. It is suitable for one-time molding of products with complex structures without the need for secondary processing.
Structural characteristics Bulk polymers form a rigid three-dimensional network structure through chemical cross-linking and cannot be repeatedly processed and molded. Linear polymer, can be processed repeatedly.

PI (Polyimide) Performance Table (Technical Data Sheet)

Test items Test standards unit JHPI-10 JHPI-10-21 JHPI-10-22 JHPI-HT JHPI-YS JSJHTPI-01 JSJHTPI-02
density ISO 1183 g/cm³ 1.40 1.43 1.7 1.4 1.36 1.32 1.36
tensile strength ISO 527 MPa 96 90 60 92 121 90 97
Elongation at break ISO 527 % 10 5 2.5 8 13 8 8
Bending strength ISO 178 MPa 148 126 90 140 171 130 138
Simply supported beam impact strength ISO 179 kJ/m² 90 135 13 88 (No Break) 100 (No Break)
Heat deformation temperature ISO 75-1/-2 °C >300 >300 >300 >320 255 230 250
Continuous use temperature UL746B °C 350 350 350 380 250 250 250