| Equipment Overview |
| Double-lapping machines are mainly used for grinding crystals or other mechanical parts with two parallel sides, especially for processing thin and brittle materials. |
| Applicable range |
| The upper and lower grinding discs rotate in opposite directions, and the workpiece undergoes a planetary motion within the carrier, simultaneously revolving and rotating. This results in low grinding resistance, minimizing workpiece damage, and high production efficiency due to uniform grinding on both sides. It features a grating thickness control system, allowing for controllable thickness tolerances on the processed product. A double-sided grinding machine includes two grinding discs, a rotary wheel, four motors, a sun gear, and a finishing machine. Compared to single-sided grinding, double-sided grinding machines are more complex in structure, but for workpieces requiring double-sided grinding, they are effectively twice as efficient. The development of double-sided grinding machines has improved production efficiency in many industries. Common applications include silicon wafers, sapphire substrates, and epitaxial wafers in the optical glass industry. |