High-strength insulation material is here! PEEK material, modified from glass fiber, is perfectly suited for high-temperature, high-pressure, and high-strength applications, such as cable conduits, connectors, and switches, and has been widely used in semiconductor manufacturing and the electronics industry.
1. Superior mechanical strength and rigidity: Stronger and harder than pure PEEK.
2. Maintains dimensional stability and low creep under high temperature and high pressure environments.
3. Low coefficient of thermal expansion: Reduces the impact of temperature changes and has lower thermal conductivity.
Performance advantages of PEEK (polyetheretherketone):
High temperature resistance: It has a high glass transition temperature (Tg=143℃) and melting point (Tm=343℃), its load heat distortion temperature is as high as 316℃, and its instantaneous service temperature can reach 320℃.
Mechanical properties: It has both rigidity and flexibility, and its fatigue resistance under alternating stress is particularly outstanding, comparable to that of alloy materials.
Self-lubricating properties: It has excellent sliding characteristics and is suitable for applications that require low coefficient of friction and wear resistance. In particular, PEEK modified with a mixture of carbon fiber and graphite in certain proportions has better self-lubricating properties.
Corrosion resistance: Except for concentrated sulfuric acid, PEEK is insoluble in any solvent, strong acid, or strong alkali at room temperature. It is also resistant to hydrolysis, has very low water absorption, and has high chemical stability.
Flame retardancy: It is self-extinguishing and can reach the UL standard of 94V-0 even without the addition of any flame retardant.
Processability: It can be processed in a variety of ways, such as injection molding, extrusion molding, compression molding and melt spinning.
Peel resistance: It has excellent peel resistance, so it can be made into very thin-walled wires or magnets and can be used under harsh conditions.
Fatigue resistance: It has the best fatigue resistance among all resins.
Radiation resistance: It has a very strong ability to withstand high radiation, exceeding that of polystyrene, which has the best radiation resistance among general-purpose resins. It can be made into a high-performance resin that still maintains good insulation properties when exposed to gamma radiation doses up to 1100 Mrad.
Hydrolysis resistance: PEEK and its composites are not chemically affected by water and high-pressure steam. Products made from this material can maintain excellent properties even after continuous use in high-temperature and high-pressure water.
Safe and environmentally friendly: PEEK has low smoke emission and low toxic gas emission: Like many organic materials, PEEK mainly produces carbon dioxide and water when it decomposes at high temperatures.
Electrical properties: It has excellent electrical insulation properties, which are maintained over a very high temperature range. Its dielectric loss is also very low at high frequencies.
Dimensional stability: PEEK has a small coefficient of thermal expansion, and changes in environmental conditions such as temperature and humidity have little impact on the dimensions of PEEK parts, which can meet the requirements of use in working conditions with high dimensional accuracy.
| Test Project | Test standards or instruments | unit | PEEK5600GF30 |
|---|---|---|---|
| Mechanical properties | |||
| Tensile strength (23℃) | ISO 527-2/1B/50 | MPa | 175 |
| Tensile modulus (23℃) | ISO 527-2/1B/51 | GPa | 12 |
| Elongation at break (23℃) | ISO 527-2/1B/50 | % | 4.5 |
| Bending strength (23℃) | ISO 178 | MPa | 268 |
| Flexural modulus (23℃) | ISO 178 | GPa | 11.5 |
| Compressive strength (23℃) | ISO 604 | MPa | / |
| Impact strength of simply supported beam (without notch) | ISO 179/U | KJ/m 2 | 55 |
| Impact strength of cantilever beam (notch) | ISO 180/A | KJ/m 2 | 10 |
| thermal properties | |||
| Melting point | DSC | ℃ | 343 |
| Heat distortion temperature | ISO 75-1/-2 | ℃ | 330 |
| Continuous operating temperature | UL 746B | ℃ | 260 |
| coefficient of thermal expansion | ASTM D696 | ppm K-1 | 46 |
| Flammability rating | UL 94 | / | V-0 |
| thermal conductivity | ISO 22007 | W/（m ·K） | / |
| Electrical performance | |||
| Dielectric strength | IEC 60243-1 | KV/mm | 25 |
| Dielectric constant | IEC 60250 | – | 3.2 |
| Surface resistance | IEC 61340 | Oh | 1016 |
| Loss medium | IEC 60251 | – | 0.005 |
| Other performance | |||
| color | – | True Colors | |
| Real density | ISO 1183 | g/cm 3 | 1.5 |
| Water absorption rate (25℃.24Hrs) | ISO 62 | % | 0.3 |
| Molding shrinkage (25-24℃) | 3mm thickness, flow direction | % | 0.3 |
| Perpendicular to the flow direction | % | 0.8 | |
| Poisson’s ratio | ISO 527-2 | / | |
| Rockwell hardness | GB/T 3398.2 | HRR | 120 |
| coefficient of friction | ASTM D3702 | m | / |
| Melt Flow Index | ISO 1133 | g/10min | 3 |
1. Typical values are for injection molding. Please contact our technical department for more detailed technical specifications if needed!
2. These performance indicators should not be used as material acceptance criteria.
Jiangsu Junhua Co., Ltd.
Leveraging over 18 years of experience in the PEEK industry, the company has achieved PEEK resin polymerization production, providing stronger raw material security and creating advantageous conditions for PEEK parts and profiles. Junhua has become a fully integrated enterprise with capabilities in PEEK resin raw material polymerization, modification and granulation, continuous extrusion of sheet and bar profiles, and R&D and production of finished parts, boasting significant cost and technological advantages!
Against the backdrop of reshaping the global supply chain landscape, the domestic substitution of high-performance specialty engineering plastics has become a focal point in the industry. Leveraging its independent R&D capabilities and large-scale production advantages, Junhua Technology continues to drive performance breakthroughs and cost optimization in high-end materials such as PEEK and PI, contributing to supply chain security and technological innovation in fields such as aerospace, new energy vehicles, and electronic semiconductors.